Temperature-dependent die warpage measurements show the possibility to analyze the thermomechanical behavior during assembly, e.g. within soldering processes. The warpage data acquisition is realized by confocal chromatic white light profilometry in combination with a precision heating/cooling chuck encapsulated in a chamber with optical access. The combination of these two tools allows precise die warpage evaluation under varied device temperature up to +400°C. This method helps to solve emerging challenges due to warpage during assembly of state of the art packages including thin dies and stacked dies as in e.g. 3D-SIPs.