NCF (Non Conductivity Film) is a material used for under-fill purpose in the TSV (Through Silicon Via) process, and is a key material for ensuring TSV 3D Package (PKG) reliability. Among the types of defects generated by the NCF, the most typical type is delamination. Particularly in NCF delamination frequently occurs during reliability test, we analyzed chemical state change of NCF according to reliability test step/condition by utilizing FTIR and TMA. Through these studies, we clarify the cause of Delamination.

delamination, electronic packages, Fourier transform infrared spectroscopy, reliability test, thermomechanical analysis, through-silicon vias
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Copyright © 2017 ASM International. All rights reserved.
2017
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Reliability testing Fourier transform infrared spectroscopy
Issue Section:
3D Devices and Packages
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