Here, we demonstrate how electro optical terahertz pulse reflectometry (EOTPR) can be used to quickly and non-destructively isolate faults in 2.5D packages. We present case studies to show how EOTPR can unambiguously differentiate between faults located in the C4 bump, TSV, RDL, and micro-bump of a 2.5D package.

C4 bumps, electro optical terahertz pulse reflectometry, failure analysis, fault isolation, fault localization, micro-bumps, redistribution layers, through-silicon vias
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Copyright © 2017 ASM International. All rights reserved.
2017
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Test method evaluation
Issue Section:
3D Devices and Packages
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