This paper describes how a DDR loopback test failure was analyzed successfully after being repackaged from an MBGA into a TBGA package substrate. DDR loopback test methodology is discussed as well as the advanced failure analysis techniques that were used to identify the root cause of failure.

ball grid array packages, double data rate loopback test, root cause analysis
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Copyright © 2017 ASM International. All rights reserved.
2017
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Root cause analysis
Issue Section:
Low Power Devices
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