Steps Toward Automated Deprocessing of Integrated Circuits

This paper discusses the development of an extensible programmatic workflow that leverages evolving technologies in 2D/3D imaging, distributed instrument control, image processing, and automated mechanical/chemical deprocessing technology. Initial studies involve automated backside mechanical ultra-thinning of 65nm node IC processor chips in combination with SEM imaging and X-ray tomography. Areas as large as 800μm x 800μm were deprocessed using gas-assisted plasma FIB delayering. Ongoing work involves enhancing the workflow with “intelligent automation” by bridging FIB-SEM instrument control and near real-time data analysis to establish a computationally guided microscopy suite.