An advanced sample preparation protocol using Xe+ Plasma FIB for increasing FA throughput is proposed. We prepared cross-sections of 400 μm and wider in challenging samples such as a BGA (CSP), bond wires in mold compound or a TSV array. These often suffer from FIB milling artifacts. The unsatisfactory quality of the cross-section face is mainly due to extremely different milling rates of the various materials (polyimide, tin, copper, mold compound, platinum), ion beam induced ripples  or due to significant surface topography. We explored the usability of the protocol for standard cross-sections and also tested the preparation of TEM lamellae. The process parameters of the proposed approach were compared with the standard methods of Xe+ Plasma FIB FA with respect to preparation time and cross-section quality. Aiming for ultimate results, we incorporated the Rocking stage technique which also greatly improves cross-section quality.