Abstract

Device failure analysis typically requires multiple systems for fault identification, preparation and analysis. In this paper we discuss the practicalities and limits of using a single FIBSEM system for a complete failure analysis workflow. The theoretical requirements of using a nanomanipulator for both lamella lift out and electrical testing are discussed and the current capabilities of windowless X-rays detectors for chemical analysis demonstrated. When the required resolution for failure analysis exceed the limits of a FIBSEM and TEM is required, the combination of the nanomanipulator and X-ray detector for advanced lift out and thickness controlled thinning techniques are demonstrated to prepare exceptional quality lamellae.

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