TEM Sample Prep Tool Matching—DualBeam FIB Cut Look and Measure Monitoring for Process Control and Development in a 300 mm IC Fab

This work presents a novel method of continuous improvement for faster, better and cheaper TEM sample preparation using Cut Look and Measure (CLM). The improvement of the process is executed by operational monitoring of daily beam conditions, end products, bulk thickness control, recipe usage and tool running time. This process produces a consequent decrease in rework rate and process time. In addition, it also increases throughput with better quality TEM samples.