Enabling Electro-Optical Failure Analysis within Extreme Compression Test Architecture

Driven by the need for higher test-compression, increasingly many chip-makers are adopting new DFT architectures such as “Extreme-Compression” (XTR, supported by Synopsys) with on-chip pattern generation and MISR based compression of chain output data. This paper discusses test-loop requirements in general and gives Advantest 93k specific guidelines on test-pattern release and ATE setup necessary to enable the most established EFA techniques such as LVP and SDL (aka DLS, LADA) within the XTR test architecture.