Abstract

This paper outlines the physical analysis approach to investigate droplet-like copper discoloration defects. These defects are proven to be caused by differences in copper oxidation based on quantification results of the CuO and Cu2O chemical states using X-ray photoelectron spectroscopy (XPS) analysis.

copper discolorations, copper oxidation, failure analysis, solderability, X-ray photoelectron spectroscopy
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Copyright © 2016 ASM International. All rights reserved.
2016
ASM International
Topics
Semiconductor wafer fabrication Solderability X-ray photoelectron spectroscopy Copper
Issue Section:
Microscopy
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