As technology continues to scale down, semiconductor devices and circuitry have become more complex. The layouts are more integrated and the devices do not isolate at contact level like they used to. Due to this, nanoprobing cannot always localize the defect to one gate finger and as a result the follow-on physical analysis gets more complicated and time consuming. In this paper, we will explore an approach to simplify a given circuit and localize the failing finger in that circuit by cutting metal lines using diamond nano-probes  on the FEI Hyperion Atomic Force Probe (AFP) Platform. We will also describe some of the other applications of diamond nano-probes in facilitating semiconductor failure analysis.