Visible light laser voltage probing (LVP) for backside improved optical spatial resolution is demonstrated on ultrathinned bulk Si samples. A prototype system for data acquisition, a method to produce ultra-thinned bulk samples as well as LVP signal, imaging, and waveform acquisition are described on bulk Si devices. Spatial resolution and signal comparison with conventional, infrared LVP analysis is discussed.

failure analysis, laser voltage probing, semiconductor devices, silicon
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Copyright © 2015 ASM International. All rights reserved.
2015
ASM International
Topics
Semiconductor wafer fabrication Silicon
Issue Section:
Advanced Methods and Techniques
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