Optical Fault Isolation and Nanoprobing Techniques for the 10 nm Technology Node and Beyond

Resolution of optical fault isolation (FI) and nanoprobing tools needs to keep pace with the device downscaling to be effective for semiconductor process development. In this paper we present and discuss state-of-the-art FI and nanoprobing techniques evaluated on Intel test-chips fabricated on next generation process technology. Promising results were obtained but further improvements are necessary for the 7nm node and beyond.