Comparison of Photon and Thermal Emission Microscopy for Dynamic Fault Isolation

Unlike photon emission microscopy which is usually the first go-to technique in tester-based or dynamic electrical fault localization, infrared thermal microscopy does not play a similar routine role despite its comparable ease in application. While thermal emission lacks in optical resolution, we demonstrate superior sensitivity and accuracy over photon emission on dynamic fault localization of backend-of-line short defects.