Soft Defect Localization on Analog and Mixed-Signal ICs Using an OBIRCH Tool

It is difficult to localize the soft defect on analog and mixed-signal ICs only by OBIRCH, because OBIRCH laser scanning module could not synchronize with the IC under functional test, and the failure modes on analog and mixed-signal ICs are complicated. In this paper, a dynamic synchronization method is proposed to localize the soft defect precisely only with an OBIRCH tool on analog and mixed-signal ICs. The methodology and system configuration are presented. A case is studied successfully on an analog and mixed-signal IC using this method.