Abstract

A sample preparation technique for flip chips (FC) deprocessing from the back side proposed. The technique uses HNA chemistry (consisting of a mixture of acids: hydrofluoric, nitric and acetic) to wet-etch the heavily-borondoped Si bulk substrate selectively to the lightly-boron-doped Si epi. The procedure can be used as a FC device sample preparation technique for back-side optical probing and FIB editing.

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