How to Locate Resistance VIA by Analysing Schematic Combined with EMMI Result on Integrated Circuit Failed at Cold Temperature

Due to the decreasing metal line size on complicated integrated circuit, non-destructive analysis strategy such as EMMI (Emission Microscope) is very significant to failure analysis, especially when special cold temperature failures are encountered. When combined with efficient schematic and layout analysis, the real defect can be localized without much microprobe work.