Comparison of Magnetic Field Imaging and Thermal Laser Stimulation for Detecting Electrically Shorting Defects within a Die BEOL

Magnetic Field Imaging (MFI) and Thermal Laser Stimulation (TLS) failure analysis (FA) techniques (e.g. OBIRCH, XIVA, ect.) both have advantages and disadvantages. The obstacles encountered from these techniques may hinder further fault isolation (FI), lengthen turn-around-time and/or detract from actionable results. MFI using a Giant Magneto Resistance (GMR) sensor is compared to TLS techniques to understand the capability of the MFI technique at finding shorting defects. A short within a capacitor bank is successfully isolated using both techniques.