Abstract
The most common methodologies for determining whether a component should be judged suspect counterfeit, or not, rely on visual examination, electrical test, and X-ray examinations. While these are commonly sufficient at such determinations, more thorough examinations may be pursued - in particular materials characterizations. In this paper, examples are given in which such “non-standard” methods are employed. Additionally, the results of an investigation as to the applicability of such methods towards detection of surface alteration to facilitate repackaging are described.
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2015
ASM International
Issue Section:
Counterfeit Microelectronics
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