The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.

copper alloy wires, decapsulation, electromagnetic compatibility, failure analysis, silver alloy wires
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Packaging and Assembly Analysis
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