Abstract
The introduction of silver as bonding material led to new failure analysis issues. This study compares the efficiency of wet and dry chemistries for decapsulation on Cu and Ag-based alloy wires. It is shown that dry chemistry allows better control and selectivity on the EMC/ Cu and Ag-based bond wires.
This content is only available as a PDF.
Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Issue Section:
Packaging and Assembly Analysis
You do not currently have access to this content.