Possible methods for counterfeit electronic part detection can be classified into two main categories: physical inspection and electrical testing. The physical inspection techniques can potentially be extended to different integrated circuit (IC) types; however, there are some challenges. The major contribution of this paper is to tackle these issues by introducing and optimizing two novel three and four dimensional imaging techniques that can provide us with the necessary information on interior and exterior geometry along with the material composition for the parts under test: four-dimensional scanning electron microscopy and dual energy 3D x-ray microscopy. In this study, advanced image processing and image analysis tools are utilized to establish a more consistent and accurate image perception. Inconsistencies within the samples and their defects are also used as an alternative to having a golden IC. However, the final decision has further been validated using results from five known authentic samples.