Aluminum-copper alloys are popular for many applications that take advantage of the combination of properties in the alloys. This paper describes the use of multiple advanced failure analysis tools to analyze the physical and chemical properties of Al-Cu alloy thin films.

aluminum-copper alloys, atomic force microscopy, chemical properties, electron backscatter diffraction, failure analysis, physical properties, time-of-flight secondary ion mass spectrometry, transmission electron microscopy, X-ray photoelectron spectroscopy
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Aluminum-copper alloys Transmission electron microscopy Atomic force microscopy Semiconductor wafer fabrication Chemical properties Physical properties Time-of-flight secondary ion mass spectrometry X-ray photoelectron spectroscopy Electron backscatter diffraction
Issue Section:
In-Line Metrology and Inspection
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