This paper presents a systematic approach of failure analysis to determine the source of electrical overstress condition to a digital variable gain amplifier (DVGA) module where the failure was due to attenuation accuracy. Having consideration of the physical evidence on the failed devices and the root cause of the failure gives an insight of how the mechanical damage caused an electrical overstress exposure to the devices. The paper provides information on destructive analysis and non-destructive analysis conducted for determining the root cause of the failure of the DVGA module. Analysis revealed that devices failed due to an electrical overstress exposure through mechanical damage to the passivation of the metal-2 lines. The mechanical damage occurred during die-sort testing due to misalignment of the probes which delivered unintended electrical stress to the devices.

This content is only available as a PDF.
You do not currently have access to this content.