Various electrical probing and nano probing solutions are offered for semiconductor or failure analysis labs. Using a focused ion beam (FIB) instrument, it is possible to make modifications to probe tips used in optical and SEM probe stations for improved ohmic contact and probe tip durability. The other added benefit is cost reduction by being able to reconstruct damaged tips. This paper shows various FIB techniques and compares reconstructed tip performance with new probe tips.

durability, electrical probing, failure analysis, focused ion beam, nano probing, ohmic contacts, optical probe tips, scanning electron microscope, semiconductor devices
This content is only available as a PDF.
Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Scanning electron microscopy Semiconductor wafer fabrication
Issue Section:
Microscopy
You do not currently have access to this content.