Traditional time domain reflectometry (TDR) techniques employ time-based information to locate faults within packages with minimal references to internal structures. Here, we combine a novel and innovative technique, electro optical terahertz pulse reflectometry (EOTPR) [1], with full 3D device-under-test (DUT) modelling to quickly and nondestructively perform feature-based analysis. We demonstrate fault isolation to an accuracy of 10 ìm or better with respect to device features in an advanced integrated circuit (IC) package.

accuracy, device under test, electro optical terahertz pulse reflectometry, failure analysis, fault isolation, integrated circuit packages, time domain reflectometry
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication Test method evaluation
Issue Section:
Packaging and Assembly Analysis
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