This article describes how 3D Real Time X-Ray (RTX) technique enhances the capability of package-level failure analysis of a flip-chip package. 3D RTX was successful in detecting different failure signatures. This paper outlines detailed applications of 3D RTX with case studies.

failure analysis, flip-chip C4 packages, real time X-ray analysis
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Electronic packaging Three-dimensional microscopy Semiconductor wafer fabrication
Issue Section:
Packaging and Assembly Analysis
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