In this study, a comprehensive investigation of the Ag-Al bond degradation mechanism in an electrically failed module using the argon ion milling, scanning electron microscopy (SEM), dual beam focused ion beam-SEM, scanning transmission electron microscopy energy dispersive x-ray spectroscopy, and time-of-flight secondary ion mass spectrometry is reported. It is found that the bond degradation is due to the galvanic corrosion in the Ag-Al bonding area. Specific attention is given to the information of microstructures, elements, and corrosive ions in the degraded bond. In this study, it is believed that the Ag-Al bond degradation is highly related to the packaging designs.

aluminum-silver alloys, argon ion milling, bond degradation, energy dispersive X-ray spectroscopy, focused ion beam, galvanic corrosion, microelectronic packaging, scanning electron microscopy, scanning transmission electron microscopy, time-of-flight secondary ion mass spectrometry
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Galvanic corrosion Electronic packaging Aluminum alloys Scanning electron microscopy Scanning transmission electron microscopy Semiconductor wafer fabrication Time-of-flight secondary ion mass spectrometry Energy dispersive X-ray spectroscopy
Issue Section:
Packaging and Assembly Analysis
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