This paper will illustrate the procedures to physically isolate one die in a stacked-die configuration. This highly reliable, systematic method allows for failure analysis engineers of all levels to successfully isolate the die of interest for further investigation.

die stacking configuration, failure analysis, systematic methods
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Copyright © 2014 ASM International. All rights reserved.
2014
ASM International
Topics
Specimen preparation Semiconductor wafer fabrication
Issue Section:
3D Packages
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