Abstract

Wafer level tester-based fault isolation (FI) tool exists back in 2008 but is not widely adopted by industry. This is expected because such tool is commonly known for its primary role in dynamic electrical FI. Since packages are readily available, there is little motivation in using wafers. This paper provides a different perspective to consider such tool as part of a wafer level debug solution to enhance current failure pre diagnostic and diagnosis capabilities, to meet requirements for fast and effective yield ramp. Test cases are presented to support this perspective and a roadmap that guides next generation wafer level FI tool is also proposed at the end of the paper.

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