This paper demonstrates a new de-process flow for MEMS motion sensor failure analysis, using layer by layer deprocessing to locate defect points. Analysis tools used in this new process flow include IR optical microscopy, thermal system, SEM and a cutting system to de-process of MEMS motion sensor and successful observation defect points.

cutting systems, deprocessing, failure analysis, infrared optical microscopy, MEMS motion sensors, scanning electron microscope , thermal systems
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Copyright © 2013 ASM International. All rights reserved.
2013
ASM International
Topics
Specimen preparation Scanning electron microscopy Optical light microscopy Semiconductor wafer fabrication
Issue Section:
Sample Preparation
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