An enhanced back-side deprocessing recipe has been established with an additional heat step compared to previous methods. This enhanced recipe reduces overall deprocessing time by 70%. The edges with higher silicon thickness can be polished simultaneously. This recipe has proved repeatable and successful across different technology nodes and die sizes.

deprocessing, failure analysis, polishing, semiconductor devices, silicon
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Copyright © 2013 ASM International. All rights reserved.
2013
ASM International
Topics
Specimen preparation Lapping and polishing Silicon
Issue Section:
Sample Preparation
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