Glass Interposer Reliability Improvement by Transient Thermal Modelling and Physical Analysis

In this paper we develop a failure analysis approach based on software weaknesses prediction on the glass interposer packaging. The main objective of this work consists of the reliability improvement of through glass via (TGV) by modeling and simulating the transient thermal cycling load on the glass interposer. Our study consists in a single TGV and the whole package models analysis. Then, we will discuss the benefits and issues of each one. Furthermore, a thermal cycling test and physical analysis in critical areas are done in order to identify the defects failure modes.