Failure Localization of an Electrical Transient Behavior on a Mixed-Mode IC by Using Static Emission Microscopy Technique

This paper presents a case study on reliability reject on a Freescale mixed-mode IC. It focuses on a novel use of one of most frequently used failure localization techniques: static emission microscopy (EMMI) to localize a failure due to an electrical transient behavior. This work helped Freescale to identify a wafer fab process limitation and contributed to test improvement.