This paper demonstrates the application of fractography on ductile fracture in gold wire bonding and brittle fracture in micro lateral crack of silicon chip. Different separation mode of a lifted wire ball was mapped through the study of various sizes of dimples, ductile zone and non-welded area. Multiple Focus Ion Beam (FIB) cuts were required at lateral crack area in order to expose the horizontal fracture features to determine the crack propagation direction.

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