Abstract
We developed the non-destructive failure analysis method that is combination of Lock-in thermography (LIT) and high resolution 3D oblique CT. It made possible to complete the total analysis efficiently, because we can distinguish the type of failure by this non-destructive method.
This content is only available as a PDF.
Copyright © 2013 ASM International. All rights reserved.
2013
ASM International
Issue Section:
Package Level Failure Analysis
You do not currently have access to this content.