We developed the non-destructive failure analysis method that is combination of Lock-in thermography (LIT) and high resolution 3D oblique CT. It made possible to complete the total analysis efficiently, because we can distinguish the type of failure by this non-destructive method.

failure analysis, lock-in thermography, X-ray computed tomography
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Copyright © 2013 ASM International. All rights reserved.
2013
ASM International
Topics
Electronic packaging X-ray microtomography Semiconductor wafer fabrication Thermography
Issue Section:
Package Level Failure Analysis
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