This paper describes 2 case studies where device characterizations using Atomic Force Probe (AFP) nanoprobing, allow for the localization and verification of design weakness and process variations on the Analog-to-Digital (ADC) block that resulted in degraded device performance and severe yield loss. In these cases, the sensitive resistor structures in the ADC block was impacted due to design pattern density interaction with process fabrication steps. In addition, close collaboration with customer was also essential for quick root cause identification, design and process fix.

analog-to-digital converter, atomic force probe, root cause analysis, semiconductor device degradation, semiconductor fabrication
This content is only available as a PDF.
Copyright © 2013 ASM International. All rights reserved.
2013
ASM International
Topics
Atomic force microscopy Semiconductor wafer fabrication Root cause analysis
Issue Section:
Nanoprobing
You do not currently have access to this content.