In this paper different sample preparation strategies for fast and efficient failure analysis of 3D devices are reviewed and further explored. It will be shown that a combined workflow using laser ablation and plasma FIB milling provides best flexibility to cover most of the FA use cases. Laser ablation guarantees fast, coarse material removal and the subsequent plasma FIB milling provides fast removal of any damage or imperfections induced by the laser ablation, precise navigation to the region of interest, a high quality surface finish allowing direct SEM imaging and analytics such as EBSD and, if required the preparation of a thin lamella for TEM analysis.

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