Deprocessing from the die backside provides a means of circuit inspection especially when the front side of die is fully covered with metallization. One of the most common techniques used is mechanical milling. It can provide good accuracy and consistency in backside preparation. However, the disadvantage of using this technique is the milling process is very time consuming. It takes at least 1-2 hours to complete the thinning and polishing process for only one unit. In addition, the equipment investment cost and later the maintenance cost (e.g. milling tools) is high. Therefore, an alternative way of backside opening is being proposed by chemical etching which is relatively fast and simple. It saves time and cost as the task can be done in less than 10 minutes while at the same time this new proposed method is still able to preserve the electrical functionality of the device.

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