This paper presents a case study on scan test reject in a mixed mode IC. It focuses on the smart use of combined mature FA techniques, such as Soft Defect Localization (SDL) and emission microscopy (EMMI), to localize a random scan test anomaly at the silicon bulk level.

dynamic laser stimulation, emission microscopy, failure analysis, mixed mode integrated circuits, scan chains, silicon, soft defect localization
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Copyright © 2012 ASM International. All rights reserved.
2012
ASM International
Topics
Microscopy Semiconductor wafer fabrication Silicon
Issue Section:
Photon Based Techniques
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