This paper uses an interesting specific case study to highlight the non-destructive fault isolation demonstration of 3DIC stacked dies applied the optical beam induced resistance change (OBIRCH) approach.

3DIC stacked dies, fault isolation, optical beam induced resistance change approach
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Copyright © 2011 ASM International. All rights reserved.
2011
ASM International
Topics
Semiconductor wafer fabrication
Issue Section:
Package Level Failure Analysis
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