A particular failure analysis case where phosphorous contamination occurred in arsenic-implanted Si is presented. Time-of-Flight secondary ion mass spectroscopy (TOF-SIMS) can be used for fast diagnosis of this contamination which shows 300% surface density change relative to the baseline. It is found that the cause of the phosphorous contamination is due to a combination of implanter chamber re-deposit cross contamination and rapid thermal annealing (RTA) process induced drive-in effect.

This content is only available as a PDF.
You do not currently have access to this content.