Abstract

Shrinking gate lengths have led to increased challenges in isolating defects using conventional physical failure analysis methods. Conducting atomic force microscopy (CAFM) has been proven to be a powerful tool to isolate gate oxide defects in silicon-on-insulator devices. Some sample preparation techniques of exposing polysilicon and gate oxide, which were critical to perform CAFM scan, are discussed in this paper.

This content is only available as a PDF.
You do not currently have access to this content.