An advanced method for LF (Lead Free) bump sample preparation to improve the surface of sample that can enhance the image of IMC (Inter Metallic Compound), solder grain boundary and micro-crack after TC (thermal cycle) reliability test is proposed. By this advanced method application, LF bump micro-crack location and propagation path can be observed easily for the reliability test fracture failure mechanism study and LF bump crack improvement further.

fracture mechanism, grain boundaries, inter metallic compounds, lead free solders, microcracks, reliability test, sample preparation, solder bumps
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Copyright © 2010 ASM International. All rights reserved.
2010
ASM International
Topics
Solders and solder alloys Specimen preparation Semiconductor wafer fabrication Reliability testing
Issue Section:
Package Level Failure Analysis
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