Currently many methods are available to obtain a junction profile of semiconductor devices, but the conventional methods have drawbacks, and they could be obstacles for junction profile analysis. This paper introduces an anodic wet etching-based two-dimensional junction profiling method, which is practical, efficient, and reliable for failure analysis and electrical characteristics evaluation.

anodic wet etching, electrical characteristics, failure analysis, junction profiling, semiconductor devices
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Copyright © 2010 ASM International. All rights reserved.
2010
ASM International
Topics
Semiconductor doping Semiconductor etching
Issue Section:
Sample Preparation
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