Abstract

This paper provides details of a novel method developed to cover a tiny epoxy layer as an intermediate buffer on the site-specific surface defect using a micro-bush on the tip of a glass needle in a plucking system without sample surface damage and localization problems. It describes the method and some real cases. The microstructures are investigated using an FEI Tecnai TF20 field emission gun transmission electron microscopy equipped with a high angle annular dark field detector, an energy dispersive X-ray spectroscopy, and Gatan image filter systems. The paper explains the micro-brushes and buffer layer preparation though figures and illustrations.

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