This paper presents a case study on via high resistance issue. A logical failure analysis process EDCA (Effect, Defect, Cause, and Action) is successfully applied to find out the failure mechanism, pinpoint the root cause and solve the problem. It sets up a very good example of how to do tough failure analysis in a controllable way.

electrical resistance, problem solving, root cause analysis, semiconductor devices
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Copyright © 2008 ASM International. All rights reserved.
2008
ASM International
Topics
Semiconductor wafer fabrication Electrical resistance Root cause analysis
Issue Section:
Failure Analysis Process
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