Some standard characterization techniques (solder ball pull, solder ball shear, etc.) exist for the assessment of solder ball mechanical fracture strength; however, it is not clear if these test methods would also provide characterization of printed circuit board (PCB) pad cratering susceptibility. This paper provides an overview of test methods being investigated by a PCB pad crater industry working group. The scope of this industry working group is two-fold: standardization of PCB pad crater crack characterization and measurement methods and development of a quantitative quality metric for PCB pad cratering. Though the test methods were successful in creating pad craters; there was not enough distinction between the various laminate material types based on the output parameters. Based on the readings from Phase 1 study and available literature, the team is in the process of completing the Phase 2 study which will be reported at a later stage.

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