Advanced semiconductor process technologies demand that patterns are milled precisely and without beam overshoot, which could damage adjacent transistors or expose neighboring interconnects. As mill box size becomes small enough and contains fewer pixels, the probability of the beam landing accurately at any given pixel for the prescribed pixel time becomes low. This has forced operators to employ higher than desired pixel times in order to preserve pattern acuity at the expense of optimized gas enhancement. In this article, the authors demonstrate the ability to machine and fill 50nm vias in advanced semiconductor process technologies. This capability is enabled directly by time of flight (ToF) operations. ToF compensation provides a significant advantage for patterning accuracy in advanced circuit edit applications. It enables FIB operators to use drastically shorter dwell times and pixel rates to enhance gas milling and deposition activities.