Abstract
Damage to encapsulated integrated circuits has recently been reported due to Laser marking of the package. A method to assess the risk of such damage is presented. The method is an analytical technique using Thermally Induced Voltage Alteration (XIVA) and Optical Beam Induced Current (OBIC) imaging.
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Copyright © 2008 ASM International. All rights reserved.
2008
ASM International
Issue Section:
Package Level Analysis
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