Abstract

Damage to encapsulated integrated circuits has recently been reported due to Laser marking of the package. A method to assess the risk of such damage is presented. The method is an analytical technique using Thermally Induced Voltage Alteration (XIVA) and Optical Beam Induced Current (OBIC) imaging.

electronic packages, failure analysis, integrated circuits, laser marking, optical beam induced current imaging, thermally induced voltage alteration
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Copyright © 2008 ASM International. All rights reserved.
2008
ASM International
Topics
Electronic packaging Semiconductor wafer fabrication
Issue Section:
Package Level Analysis
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