By implementing two-photon optical-beam-induced current microscopy using a solid-immersion lens, imaging inside a silicon flip chip is reported with 166nm lateral resolution and an axial resolution capable of resolving features only 100nm in height.

failure analysis, flip chips, optical beam induced current microscopy, silicon, solid-immersion lens
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Copyright © 2007 ASM International. All rights reserved.
2007
ASM International
Topics
Semiconductor wafer fabrication Test method evaluation Silicon
Issue Section:
Photon Based Techniques
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